Arĝentkovrita Kupra Busa Trinkejo

√  Arĝenta tegaĵo signife plibonigas la konduktivecon de kupro

√  Bonega fortikeco kontraŭ oksigenado kaj severaj medioj.

√  Efika varmodissipado por malhelpi recalentiĝon.

√  Forta kaj fortika, eltenas fizikan streson kaj eluziĝon.

√  Fidindaj elektraj konektoj kun reduktita rezisto.

Ĉefa Arĝente Tegita Kupra Busa Fabrikisto

Ni specialiĝas pri fabrikado de altkvalitaj arĝentaj kupraj busoj tajloritaj por plenumi la postulemajn postulojn de diversaj industrioj. Niaj arĝentaj kupraj busoj estas kreitaj por escepta kondukteco, fidindeco kaj fortikeco. Kun precizeca inĝenierado kaj pintnivela arĝentplata teknologio, niaj busaj stangoj ofertas superan elektran rendimenton, certigante minimuman energiperdon kaj efikan transdonon de potenco.

1. conductor material:
- Copper purity ≥ 99.95% (e.g. T2 copper or high purity oxygen-free copper), surface silver plating layer thickness is usually 1-5μm.- Conductivity ≥ 97.6% IACS (International Annealed Copper Standard), better than ordinary copper busbar.

2. Electrical performance:
- Carrying capacity increased by more than 30% (due to the silver layer to reduce the contact resistance).- Temperature rise limit: Silver-plated busbar allows temperature rise up to 70K (bare copper is 60K), suitable for high load scenarios.

3. Physical properties:
- Tensile strength ≥15%, can withstand high-frequency vibration and mechanical shock.- Corrosion resistance: passed 1800 hours of salt spray test, suitable for humid, chemical, and other harsh environments.

4. Dimensional specifications:
- Common thickness 1.5-25mm, width 10-250mm, support customized shaped rows (such as C-type female rows).

Silver plated copper bus bar Production process:

1. Raw material processing:

• Copper rods are processed into copper strips by the top-induction method or cold-rolling process, and the surface is milled to remove the oxidized layer.

2. Pre-plating treatment:

•  Alkaline etching: 50-80 ℃ sodium hydroxide solution to clean the oil.
• Acid cleaning activation: dilute sulfuric acid to remove oxides and enhance the adhesion of the plating layer.

3. Silver plating process:

• Pre-silver plating: current density 1-3A/dm², energized for 5-10 seconds to form the bottom layer.
• Main silver plating: current density 0.5-3A/dm², temperature 15-35 ℃, plating 1.5-2.5 hours, and the thickness of the silver layer is uniform.

4. Post-treatment:

• Dip anti-silver discoloration agent (such as benzotriazole) to prevent sulfidation and oxidation.
• Laser marking, automatic inspection, and packaging.

Arĝentkovrita kupra busdrinkejo ecoj:

1. High conductivity: the conductivity of silver (6.3×10⁷ S/m) is higher than that of copper (5.96×10⁷ S/m), which reduces transmission losses.
2. Oxidation resistance: silver layer isolates copper from oxygen, avoiding the generation of copper oxide and keeping low contact resistance.
3. High-frequency adaptability: under skin effect, the silver layer improves the stability of high-frequency signal transmission, suitable for 5G, data center and other scenarios.
4. High Temperature Resistance: Support -65℃ to 250℃ working temperature, short time resistance 300℃, better than tinned copper row.
5. Environmentally friendly: Halogen-free materials, no release of toxic gases in case of fire, passes UL94 flame retardant standard.

Kial busbaroj estas arĝente tegitaj?

Busbaroj ofte estas arĝente tegitaj pro pluraj kialoj:

• Reduced contact resistance: silver conductivity is better than copper and tin; silver plating reduces contact resistance by 30%, improving current-carrying capacity and energy efficiency.
• Resistance to corrosion and oxidation: Silver is less susceptible to corrosion in humid, sulfur/chlorine environments, avoiding performance degradation caused by oxidation of the copper substrate.
• Optimization of high-frequency performance: high-frequency current is concentrated on the surface of the conductor (skin effect), and the silver layer reduces signal attenuation and ensures communication quality.
• Extended service life: the silver plating layer is wear-resistant, suitable for frequent plugging and unplugging scenarios (such as switchgear connectors), reducing maintenance costs.
• Temperature rise control: allows a higher temperature rise (70K vs. 60K for bare copper), adapting to the needs of high-current transmission.