Plata izolita solida kupra busbar por potenco-distribuo

√  Altpura kupro por bonega elektra kondukteco.

√  Ebena profilo por facila integriĝo en diversaj sistemoj.

√  Imuna al eluziĝo, korodo kaj mediaj faktoroj.

√  Opcioj inkluzivas PVC-trempiĝon, epoksian tegaĵon aŭ varmecŝrumpas tubojn.

Via Fidinda Solida Kupra Busbar Fabrikisto

Ni specialiĝas pri fabrikado de altkvalitaj solidaj kupraj busbaroj, kiuj provizas esceptan elektran konduktivecon kaj fortikecon. Nia plej altnivela instalaĵo ebligas al ni produkti busbarojn en diversaj grandecoj kaj agordoj, tajloritaj por renkonti viajn specifajn bezonojn. Ni ofertas ampleksajn personigajn eblojn, inkluzive de precizaj dimensioj, izolaj tipoj kaj finado, certigante, ke la busbaroj perfekte kongruas en vian aplikon. Ĉu por elektraj distribuaj paneloj, ŝaltiloj aŭ renoviĝantaj energiaj sistemoj, ni liveras fidindajn solvojn dizajnitajn por optimuma rendimento kaj sekureco. Kontaktu nin hodiaŭ por diskuti viajn kutimajn postulojn pri solida kupro busbar!

Solid copper busbar Surface Production process:

1. Raw material processing: High-purity copper rods from the continuous casting and rolling process are selected, and the oxidized layer is removed by straightening and pickling.

2. Molding processing: made into a flat cross section by drawing and calendering processes to ensure the dimensional accuracy (tolerance ±0.12mm).

3. Insulation processing:

• Extrusion/Coating: Polyimide film or glass fiber is extruded at high temperature or vacuum coated to cover the copper surface.
• Curing: Heat is applied to the insulating material to form a dense protective layer.

4. Quality testing: including conductor resistance test, insulation withstand voltage test (e.g., 20 20kV/mm), aging test.

5. Finished product packaging: moisture-proof and shock-proof packaging, part of the need for shielding treatment (such as tin-plated anti-oxidation).

Solid copper busbar Surface treatment process：

1. Plating technology:

• Tin/silver plating: Enhance corrosion resistance (tin plating thickness 10-20μm) and conductivity (silver plating to reduce contact resistance).
•  Nickel plating: enhances wear resistance and oxidation resistance, suitable for high-humidity environments.

2. Passivation treatment: chemical passivation to form an oxide film to prevent copper surface oxidation.

3. Mechanical treatment:

• Polishing/Brushing: Reduce surface roughness (Ra≤0.8μm), reduce current loss.
• Sandblasting: increases the friction coefficient, suitable for anti-slip demand scenarios.

Solid copper busbar Advantages：

1. High efficiency and energy saving:

• Compared with the cable to save copper 10-35%, power loss is reduced by more than 15%.
• Low skin effect (AC resistance / DC resistance coefficient ≤ 1.1) reduces heat.

2. High reliability:

• Insulation layer is chemical resistant (e.g. PTFE), life expectancy of over 30 years.
• Support ultrasonic welding, high connection strength, and no heat-affected zone.

3. Adaptable:

• Compact design saves space, customizable bending radius (≥10 times thickness).
• Suitable for high-temperature (110℃), high-humidity, and electromagnetic interference environments.

Solid copper busbar Application：

1. Power system: high voltage switchgear (40.5kV), substation busbar, smart grid transmission.
2. New energy:

• PV/wind power inverter, new energy vehicle battery pack connection.
• Charging pile high current transmission (support more than 5000A).

3. Industrial equipment: metallurgical furnace, chemical explosion-proof power distribution system.
4. High-end manufacturing:

• Data center server power supply (such as AI server cluster).
• Aerospace and rail transportation (lightweight, high reliability requirements).

Aerospace and rail transportation (lightweight, high reliability requirements):