Busbar tembaga padat berisolasi datar untuk distribusi daya

√  Tembaga dengan kemurnian tinggi untuk konduktivitas listrik yang sangat baik.

√  Profil datar untuk memudahkan integrasi ke berbagai sistem.

√  Tahan terhadap keausan, korosi, dan faktor lingkungan.

√  Pilihannya meliputi pencelupan PVC, pelapisan epoksi, atau pipa menyusut panas.

Produsen Busbar Tembaga Padat Terpercaya Anda

Kami mengkhususkan diri dalam pembuatan busbar tembaga padat berkualitas tinggi yang memberikan konduktivitas listrik dan daya tahan yang luar biasa. Fasilitas canggih kami memungkinkan kami untuk memproduksi busbar dalam berbagai ukuran dan konfigurasi, yang disesuaikan untuk memenuhi kebutuhan spesifik Anda. Kami menawarkan opsi penyesuaian yang komprehensif, termasuk dimensi yang presisi, jenis insulasi, dan penyelesaian akhir, yang memastikan busbar sesuai dengan aplikasi Anda. Baik untuk panel distribusi daya, peralatan sakelar, atau sistem energi terbarukan, kami memberikan solusi andal yang dirancang untuk kinerja dan keamanan yang optimal. Hubungi kami hari ini untuk mendiskusikan kebutuhan busbar tembaga padat khusus Anda!

Solid copper busbar Surface Production process:

1. Raw material processing: High-purity copper rods from the continuous casting and rolling process are selected, and the oxidized layer is removed by straightening and pickling.

2. Molding processing: made into a flat cross section by drawing and calendering processes to ensure the dimensional accuracy (tolerance ±0.12mm).

3. Insulation processing:

• Extrusion/Coating: Polyimide film or glass fiber is extruded at high temperature or vacuum coated to cover the copper surface.
• Curing: Heat is applied to the insulating material to form a dense protective layer.

4. Quality testing: including conductor resistance test, insulation withstand voltage test (e.g., 20 20kV/mm), aging test.

5. Finished product packaging: moisture-proof and shock-proof packaging, part of the need for shielding treatment (such as tin-plated anti-oxidation).

Solid copper busbar Surface treatment process：

1. Plating technology:

• Tin/silver plating: Enhance corrosion resistance (tin plating thickness 10-20μm) and conductivity (silver plating to reduce contact resistance).
•  Nickel plating: enhances wear resistance and oxidation resistance, suitable for high-humidity environments.

2. Passivation treatment: chemical passivation to form an oxide film to prevent copper surface oxidation.

3. Mechanical treatment:

• Polishing/Brushing: Reduce surface roughness (Ra≤0.8μm), reduce current loss.
• Sandblasting: increases the friction coefficient, suitable for anti-slip demand scenarios.

Solid copper busbar Advantages：

1. High efficiency and energy saving:

• Compared with the cable to save copper 10-35%, power loss is reduced by more than 15%.
• Low skin effect (AC resistance / DC resistance coefficient ≤ 1.1) reduces heat.

2. High reliability:

• Insulation layer is chemical resistant (e.g. PTFE), life expectancy of over 30 years.
• Support ultrasonic welding, high connection strength, and no heat-affected zone.

3. Adaptable:

• Compact design saves space, customizable bending radius (≥10 times thickness).
• Suitable for high-temperature (110℃), high-humidity, and electromagnetic interference environments.

Solid copper busbar Application：

1. Power system: high voltage switchgear (40.5kV), substation busbar, smart grid transmission.
2. New energy:

• PV/wind power inverter, new energy vehicle battery pack connection.
• Charging pile high current transmission (support more than 5000A).

3. Industrial equipment: metallurgical furnace, chemical explosion-proof power distribution system.
4. High-end manufacturing:

• Data center server power supply (such as AI server cluster).
• Aerospace and rail transportation (lightweight, high reliability requirements).

Aerospace and rail transportation (lightweight, high reliability requirements):