Batang bus tembaga berlapis nikel

√  Konduktivitas listrik yang sangat baik untuk distribusi daya yang efisien

√  Peningkatan kekuatan mekanis dan ketahanan aus.

√  Mencegah oksidasi, menjaga kinerja yang konsisten.

√  Kinerja yang andal pada rentang suhu yang luas.

√  Tersedia dalam berbagai ukuran dan konfigurasi.

Produsen Busbar Tembaga Berlapis Nikel Premier Anda

Sebagai produsen utama, pabrik kami mengkhususkan diri dalam memproduksi busbar tembaga berlapis nikel berkualitas tinggi untuk distribusi daya yang efisien dan andal. Busbar tembaga kami dibuat dari tembaga dengan kemurnian tinggi dan dilapisi dengan lapisan nikel yang tahan lama, yang dirancang untuk memenuhi tuntutan ketat berbagai aplikasi industri dan komersial.

Production Process of nickel plate copper bus bar:

1. Copper wire preparation:
Adopt high-purity electrolytic copper through drawing and stranding processes to process it into the required diameter of copper wire, with tolerance control within ± 0.005mm.
2. Surface treatment:
Copper wire by ultrasonic cleaning and acid washing (such as with sulfamic acid) to remove surface oil and oxides.
3. Electroplating nickel layer:
Adopt the electroplating or chemical plating process, and control the current density (2-5A/dm²), temperature (50-60℃) and pH (3.5-5.5) to form a uniform and dense nickel layer.
4. Post-treatment:
Annealing to eliminate internal stress, ultrasonic cleaning to remove residues, drying and testing of coating thickness, bonding force, and other indicators.
5. Quality Inspection:
The use of high-precision instruments to detect the conductivity, plating uniformity, and corrosion resistance (such as salt spray test).

Mengapa Busbar Dilapisi Nikel?

1. Corrosion resistance:
Nickel in the humid, salt spray environment can form a passivation film, preventing oxidation of the copper substrate, prolonging the life of the busbar.
2. Reduce contact resistance:
The nickel layer has a smooth surface, which reduces the roughness of the contact surface and avoids the elevated resistance caused by oxidized copper and improves the efficiency of current transmission.
3. Abrasion resistance:
Nickel hardness (HV200-300) is much higher than copper (HV40-60), suitable for sliding contact scenarios (e.g. drawer cabinet connectors).
4. Solderability:
The nickel plating layer is stable at high temperature, superior to tin plating (easy to produce tin whiskers), and suitable for high-frequency welding processes.

Apa kegunaan tembaga berlapis nikel?

With its high electrical conductivity, corrosion resistance, and abrasion resistance, nickel-plated copper is widely used in electronic communications, new energy, industrial manufacturing, and other fields: in electronic communications, it is used in 5G equipment, high-frequency circuit boards, and precision sensors to ensure the stable transmission of signals; in the new energy automotive and photovoltaic industries, it is used as a battery connector and high-voltage conductor to adapt to high temperatures, salt spray, and other harsh environments; and it is used for abrasion-resistant mechanical parts and chemical pipelines to resist friction and cost in the industry.

With the development of 5G, electric vehicles, and other industries, the application of nickel-plated copper will continue to expand in scenarios that require high conductivity and durability.

Apakah tembaga berlapis nikel lebih baik dari tembaga?

Sebagai produsen, kami menyadari bahwa kesesuaian tembaga berlapis nikel dibandingkan tembaga murni bergantung pada persyaratan aplikasi tertentu. Tembaga berlapis nikel menawarkan keunggulan dalam hal ketahanan korosi yang lebih baik, pencegahan oksidasi, dan peningkatan daya tahan dibandingkan dengan tembaga murni. Manfaat-manfaat ini membuat tembaga berlapis nikel sangat cocok untuk aplikasi yang diperkirakan akan terpapar lingkungan yang keras, zat korosif, atau penggunaan dalam jangka panjang. Namun, tembaga murni mungkin lebih disukai dalam aplikasi yang mengutamakan efektivitas biaya atau ketahanan listrik minimal. Pada akhirnya, pilihan antara tembaga berlapis nikel dan tembaga murni bergantung pada faktor-faktor seperti kondisi lingkungan, ekspektasi kinerja, dan kendala anggaran.