銀メッキ銅バスバー

√  銀メッキは銅の導電性を大幅に向上させます

√  酸化や過酷な環境に対する優れた耐久性。

√  効率的な放熱により過熱を防ぎます。

√  強くて丈夫で、物理的なストレスや摩耗に耐えます。

√  抵抗が低減された信頼性の高い電気接続。

銀メッキ銅バスバーの大手メーカー

当社は、さまざまな業界の厳しい要件を満たすようにカスタマイズされた高品質の銀メッキ銅バスバーの製造を専門としています。当社の銀メッキ銅バスバーは、優れた導電性、信頼性、耐久性を実現するように設計されています。精密なエンジニアリングと最先端の銀メッキ技術により、当社のバスバーは優れた電気性能を提供し、エネルギー損失を最小限に抑え、効率的な電力伝送を保証します。

1. conductor material:
- Copper purity ≥ 99.95% (e.g. T2 copper or high purity oxygen-free copper), surface silver plating layer thickness is usually 1-5μm.- Conductivity ≥ 97.6% IACS (International Annealed Copper Standard), better than ordinary copper busbar.

2. Electrical performance:
- Carrying capacity increased by more than 30% (due to the silver layer to reduce the contact resistance).- Temperature rise limit: Silver-plated busbar allows temperature rise up to 70K (bare copper is 60K), suitable for high load scenarios.

3. Physical properties:
- Tensile strength ≥15%, can withstand high-frequency vibration and mechanical shock.- Corrosion resistance: passed 1800 hours of salt spray test, suitable for humid, chemical, and other harsh environments.

4. Dimensional specifications:
- Common thickness 1.5-25mm, width 10-250mm, support customized shaped rows (such as C-type female rows).

Silver plated copper bus bar Production process:

1. Raw material processing:

• Copper rods are processed into copper strips by the top-induction method or cold-rolling process, and the surface is milled to remove the oxidized layer.

2. Pre-plating treatment:

•  Alkaline etching: 50-80 ℃ sodium hydroxide solution to clean the oil.
• Acid cleaning activation: dilute sulfuric acid to remove oxides and enhance the adhesion of the plating layer.

3. Silver plating process:

• Pre-silver plating: current density 1-3A/dm², energized for 5-10 seconds to form the bottom layer.
• Main silver plating: current density 0.5-3A/dm², temperature 15-35 ℃, plating 1.5-2.5 hours, and the thickness of the silver layer is uniform.

4. Post-treatment:

• Dip anti-silver discoloration agent (such as benzotriazole) to prevent sulfidation and oxidation.
• Laser marking, automatic inspection, and packaging.

銀メッキ銅バスバーの特徴:

1. High conductivity: the conductivity of silver (6.3×10⁷ S/m) is higher than that of copper (5.96×10⁷ S/m), which reduces transmission losses.
2. Oxidation resistance: silver layer isolates copper from oxygen, avoiding the generation of copper oxide and keeping low contact resistance.
3. High-frequency adaptability: under skin effect, the silver layer improves the stability of high-frequency signal transmission, suitable for 5G, data center and other scenarios.
4. High Temperature Resistance: Support -65℃ to 250℃ working temperature, short time resistance 300℃, better than tinned copper row.
5. Environmentally friendly: Halogen-free materials, no release of toxic gases in case of fire, passes UL94 flame retardant standard.

バスバーはなぜ銀メッキされているのですか?

バスバーは、次のようないくつかの理由から、多くの場合銀メッキされます。

• Reduced contact resistance: silver conductivity is better than copper and tin; silver plating reduces contact resistance by 30%, improving current-carrying capacity and energy efficiency.
• Resistance to corrosion and oxidation: Silver is less susceptible to corrosion in humid, sulfur/chlorine environments, avoiding performance degradation caused by oxidation of the copper substrate.
• Optimization of high-frequency performance: high-frequency current is concentrated on the surface of the conductor (skin effect), and the silver layer reduces signal attenuation and ensures communication quality.
• Extended service life: the silver plating layer is wear-resistant, suitable for frequent plugging and unplugging scenarios (such as switchgear connectors), reducing maintenance costs.
• Temperature rise control: allows a higher temperature rise (70K vs. 60K for bare copper), adapting to the needs of high-current transmission.