The silver plated copper busbar we manufacture is a kind of power transmission material with high-purity copper (such as oxygen-free copper or low-oxygen copper) as the substrate, and the surface is covered with silver layer through electroplating process. It combines the high conductivity of copper with the oxidation resistance of silver, and is widely used in high-precision and high-reliability scenarios such as electric power systems, communication equipment, new energy vehicles, aerospace, etc. It is especially suitable for high-frequency transmission and high-current environments.
| 품목 유형: | 은도금 구리 버스바 |
|---|---|
| 재료 기반: | 은 도금 층이 있는 구리 코어입니다. |
| 은 도금 두께: | 일반적으로 5~15마이크론 범위입니다. |
| 구리 코어의 두께: | 전류 전달 용량과 애플리케이션 요구 사항에 따라 달라집니다. |
| 전압 정격: | 절연 및 설계에 따라 다양한 전압 레벨에 적합합니다. |
| 길이: | 원하는 전기 시스템의 치수에 맞게 사용자 정의가 가능합니다. |
| 너비: | 특정 애플리케이션 요구 사항에 따라 사용자 정의가 가능합니다. |
| 현재 용량: | 두께, 너비, 재료 특성에 따라 결정됩니다. |
| 온도 등급: | 일반적으로 -50°C에서 150°C까지의 넓은 온도 범위에서 작동할 수 있습니다. |
| 연장: | 30-40% (특정 합금 및 템퍼에 따라 다름) |
| 경도: | 40-80 HV(비커스 경도) |
| 주석 코팅 두께: | 3~15마이크론(사용자 정의 가능) |
| 표면 마감: | 은도금은 우수한 내식성을 제공하고 전기 전도도를 향상시킵니다. |
| 응용 프로그램: | 높은 전도성과 내식성이 요구되는 전력 분배 시스템, 전기 패널, 스위치기어 및 다양한 산업용 애플리케이션에 적합합니다. |
선도적인 은도금 구리 버스 바 제조업체
당사는 다양한 산업의 까다로운 요구 사항을 충족하도록 맞춤 제작된 고품질 은도금 구리 버스 바를 제조하는 데 특화되어 있습니다. 당사의 은도금 구리 버스 바는 뛰어난 전도성, 신뢰성 및 내구성을 위해 설계되었습니다. 정밀 엔지니어링과 최첨단 은도금 기술을 통해 당사의 버스 바는 뛰어난 전기적 성능을 제공하여 최소한의 에너지 손실과 효율적인 전력 전송을 보장합니다.
1. conductor material:
- Copper purity ≥ 99.95% (e.g. T2 copper or high purity oxygen-free copper), surface silver plating layer thickness is usually 1-5μm.- Conductivity ≥ 97.6% IACS (International Annealed Copper Standard), better than ordinary copper busbar.
2. Electrical performance:
- Carrying capacity increased by more than 30% (due to the silver layer to reduce the contact resistance).- Temperature rise limit: Silver-plated busbar allows temperature rise up to 70K (bare copper is 60K), suitable for high load scenarios.
3. Physical properties:
- Tensile strength ≥15%, can withstand high-frequency vibration and mechanical shock.- Corrosion resistance: passed 1800 hours of salt spray test, suitable for humid, chemical, and other harsh environments.
4. Dimensional specifications:
- Common thickness 1.5-25mm, width 10-250mm, support customized shaped rows (such as C-type female rows).
Silver plated copper bus bar Production process:
1. Raw material processing:
- Copper rods are processed into copper strips by the top-induction method or cold-rolling process, and the surface is milled to remove the oxidized layer.
2. Pre-plating treatment:
- Alkaline etching: 50-80 ℃ sodium hydroxide solution to clean the oil.
- Acid cleaning activation: dilute sulfuric acid to remove oxides and enhance the adhesion of the plating layer.
3. Silver plating process:
- Pre-silver plating: current density 1-3A/dm², energized for 5-10 seconds to form the bottom layer.
- Main silver plating: current density 0.5-3A/dm², temperature 15-35 ℃, plating 1.5-2.5 hours, and the thickness of the silver layer is uniform.
4. Post-treatment:
- Dip anti-silver discoloration agent (such as benzotriazole) to prevent sulfidation and oxidation.
- Laser marking, automatic inspection, and packaging.

은도금 구리 버스 바 특징:
1. High conductivity: the conductivity of silver (6.3×10⁷ S/m) is higher than that of copper (5.96×10⁷ S/m), which reduces transmission losses.
2. Oxidation resistance: silver layer isolates copper from oxygen, avoiding the generation of copper oxide and keeping low contact resistance.
3. High-frequency adaptability: under skin effect, the silver layer improves the stability of high-frequency signal transmission, suitable for 5G, data center and other scenarios.
4. High Temperature Resistance: Support -65℃ to 250℃ working temperature, short time resistance 300℃, better than tinned copper row.
5. Environmentally friendly: Halogen-free materials, no release of toxic gases in case of fire, passes UL94 flame retardant standard.
버스바에 은도금을 하는 이유는 무엇입니까?
버스바는 종종 여러 가지 이유로 은도금을 합니다.
- Reduced contact resistance: silver conductivity is better than copper and tin; silver plating reduces contact resistance by 30%, improving current-carrying capacity and energy efficiency.
- Resistance to corrosion and oxidation: Silver is less susceptible to corrosion in humid, sulfur/chlorine environments, avoiding performance degradation caused by oxidation of the copper substrate.
- Optimization of high-frequency performance: high-frequency current is concentrated on the surface of the conductor (skin effect), and the silver layer reduces signal attenuation and ensures communication quality.
- Extended service life: the silver plating layer is wear-resistant, suitable for frequent plugging and unplugging scenarios (such as switchgear connectors), reducing maintenance costs.
- Temperature rise control: allows a higher temperature rise (70K vs. 60K for bare copper), adapting to the needs of high-current transmission.


