OEM 적층 플렉시블 버스바

√  더 작은 공간에서도 높은 전류 용량을 제공합니다.

√  사전 조립된 장치로 설치가 간편합니다.

√  전압 강하와 전력 손실을 최소화합니다.

√  특정 응용 프로그램 요구 사항에 맞게 맞춤화되었습니다.

√  연결이 적을수록 실패 지점이 줄어듭니다.

귀하의 프리미어 적층형 유연 버스바 제조업체

In our factory, we specialize in designing and producing high-quality, low-inductance busbars tailored for efficient power distribution. It is made by alternating layers of conductive materials (copper or aluminum) and insulating materials, and is structured with a layer-by-layer parallel distribution, which effectively reduces the distributed inductance of the line (which can be reduced to less than 10.6nH). Its flexible design allows multi-dimensional twisting and bending (bending radius can be up to 5 times the diameter of the conductor), suitable for complex installation environments. With both low impedance and high integration, the product is widely used in new energy, rail transportation and other high-power scenarios.

적층형 유연 버스바 분류:

적층형 유연 버스바는 구조, 응용 분야, 설계 특징을 포함한 여러 요인에 따라 분류할 수 있습니다. 다음은 이러한 기준에 따른 분류입니다.

 Structure parameters

• Conductor material: T2 pure copper or 1060 aluminum (surface treatment including tin/nickel/silver plating)
• Flexible conductor: copper wire diameter 1.5-3mm, connection piece thickness 0.1-0.2mm
• Insulation: Polyester (PET, 105°C temperature resistant) or Polyimide (PI, 200°C temperature resistant)
• Flame retardant rating: UL94 V-0 (certified by combustion test)
• Protection grade: IP58 (for humid and high heat environment)

Processing parameters

• Maximum processing size: 1600 x 800mm (hot press sealing/can sealing process)
• Connection: Pressure convex, copper column riveted / welded

Production process

1. Conductor molding

• Copper wire (diameter 1.5-3mm) is made into flexible copper wire by wire drawing process with tin/silver plating on the surface.
• Copper row cut to flexible connecting piece (length 0.2-0.4mm), connecting copper wire by laser spot welding

2. Insulation treatment

• Conductors are laminated and vacuum hot-pressed (2.5 hours hot pressing + 1.5 hours cold pressing) to form an elliptical cross-section.
• Wrapped semiconductor paper inner shield, filled with epoxy resin or silicone

3. Multi-layer encapsulation

• Covered with plastic/rubber insulation, outer shield and jacket (HDPE or ceramic) in sequence
• Passed short-circuit resistance test (Rittal Labs certification)

4. Testing and verification

• Test items include insulation resistance (20MΩ-∞), temperature rise, distributed capacitance/inductance, salt spray test, etc.

Product Advantages

1. Excellent electrical performance

•  Low inductance to reduce surge voltage (reduce power device voltage requirements)
• Uniform capacitance distribution inhibit electromagnetic interference (EMI/RFI reduced by more than 30%)

2. Flexible and reliable structure

• Compensate ±5mm installation error, avoiding copper row stress deformation
• No intermediate connector design, reduce failure points (life expectancy increased by 50%)

3. Environmental adaptability

• Temperature range -30℃ to 105℃ (PI material can reach 200℃)
• IP58 protection level, suitable for underground pipeline corridors, chemical and other harsh environments.

4. Economical and efficient

• Factory prefabricated length up to kilometer (reduce time consuming on-site installation by 60%)
• Support customized design (can be developed by providing drawings or environmental parameters)

Application Fields